Breadboard Half Size Bare 400 Tie Points

🔹 Product Overview

The Breadboard Half Size Bare – 400 Tie Points is a compact solderless prototyping board used for building and testing electronic circuits without soldering. It is ideal for students, hobbyists, and engineers for quick circuit development and experimentation.

🔹 Key Features

• Total Tie Points: 400

• Terminal Strips: 300 tie points (for components and ICs)

• Power Rails: 100 tie points (2 power lines – positive & negative)

• Solderless Design: No soldering required

• Reusable: Components can be inserted and removed multiple times

• Self-Adhesive Back: Easy mounting on surfaces

• Interlocking Design: Multiple boards can be connected together

🔹 Internal Connection Layout

• The middle section is divided into rows.

• Each row of 5 holes is internally connected horizontally.

• The center gap allows easy placement of DIP ICs.

• The side power rails run vertically for VCC and GND connections.

🔹 Technical Specifications

• Material: ABS Plastic Body

• Contact Material: Phosphor Bronze with Nickel Plating

• Color: White

• Operating Voltage: Suitable for low-voltage DC circuits (typically 3V–12V)

• Compatible Wire Size: 20–29 AWG

🔹 Applications

• Arduino & Microcontroller projects

• Sensor testing

• Circuit learning & education

• Rapid prototyping

• DIY electronics

• Robotics experiments

🔹 Advantages

✔ Easy to use
✔ No soldering required
✔ Time-saving
✔ Perfect for temporary circuits
✔ Compact and portable

🔹 Package Includes

• 1 × Breadboard Half Size Bare (400 Tie Points)